Keith Koep
TECHNOLOGIE PARTNER
ARM CONNECTED Windows Freescale Marvell
nConXS
 
TECH. DATA TRIZEPS
  • TECHNICAL DATA

    Baseboard for CPU Module Baseboard for Trizeps SODIMM-200 Modules

    Compact and scalable Compact and scalable carrierboard with standard
       peripherals

    Display interfaces Supports various sizes of RGB Touchscreen LCDs
       and LVDS displays

    Interfaces Wireless Communication via Trizeps WiFi and
       Bluetooth (on request)

    Peripherals Peripherals: direct access through standard
       connectors and extension header

    Baseboard for CPU Module Baseboard for CPU Module
    Compatible computing units
    Trizeps Modules Trizeps IV-M, IV-WL, VI and MX28
    Onboard
    Display Interfaces 18 Bit RGB LCD interface for res./cap. Touch panels (3.5", 4.3", 5.0", 5.7" and 7.0"), LVDS interface (20 pin conn.), LCD backlight +12V (optional +5V), res. Touch panels (4 wire), optional cap. Touch panels I2C (20 pin conn.)
    Features 10/100 Mbit Ethernet, USB2.0-A Host and OTG, SD/MMC Card Socket, D-Sub 9 RS232, stereo headphone 3.5mm, LEDs, Realtime Clock with 3V battery
    Wireless Communication Trizeps option: Onboard WLAN and Bluetooth modules, IEEE 802.11 b/g up to +15 dBm (Trizeps IV-WL, VI), 11 Mbps (20 MHz) and up to 54 Mbps (40 MHz), Bluetooth 2.0+ (only Trizeps VI)
    Expandability
    Extension Connector 28 pin SL-2 2,54mm extension header
    Extension interfaces Power, 2x UART, 8 bit parallel camera, CAN, 2x I2C, GPIO, ADCs
    General Details
    Operating Systems Windows Embedded CE 5.0, 6.0 R3, Compact 7
    Voltage Supply Single voltage supply +12V up to +24V
    Operating Temperature -20°C to +85°C industrial
    Dimensions 130 mm x 85 mm x 20 mm
    Environmental Standard RoHS, REACH, WEEE
    Availability 10 years form, function*
    Technical modifications reserved, errors excepted / *beginning product life circle