Keith Koep
TECHNOLOGY PARTNER
ARM CONNECTED Windows Freescale Marvell
i-PAN X7 LC
 
TECH. DATA BASEBOARD TRIZEPS
  • TECHNICAL DATA

    Intelligent Touch Panel Build-in industrial PanelPC solution

    Touchscreen LCD Based on Trizeps SODIMM 200 CPU module technology
       with Freescale i.MX6 processor

    Industrial flat touchscreen 7.0" projected capacitive touchscreen LCD with
       2 mm front glass

    CPU Modules Optimal touch functionality using an optical bonding
       process to bond the display to the glass pane

    Peripherals The device is also available as an evaluation kit

    CPU Modules IP65 protection level for the frontside installation
       area

    Peripherals Peripherals: direct access via standard connectors

    Small Hmi On request: Wireless communication

    Arm HMI Glas Touch Panel PC arm hmi glas touch panel pc
    Technical Data based on Trizeps VII and pConXS LC
    Processor Freescale™ i.MX6 Solo (800 MHz), DualLite (800 MHz), Dual (1.0 GHz) or Quad (1.0 GHz)
    RAM Memory Up to 4 x 16 Bit DDR3-1066 (533MHz), 16/32/64 Bit 1 CS, 256 MByte to 1 GByte (2, 4 GByte on request)
    Flash Storage Onboard 4 Bit wide μSD Socket for μSD cards up to 32 GB (standard) or
    onboard 8 Bit wide eMMC (on request)
    Features
    Display 7.0" TFT-Display 800 x 480 pixel, projected capacitive touchscreen LCD, bonded behind 2 mm mineral glass using an optical bonding process
    Housing Enclosure front with 2 mm on one side chemically-treated anti-reflective mineral glass, IP65 protection level for the installation area (dust and splash water), glass fibre reinforced plastic housing with backside metal cover, simple assembly with clamps on the back
    Interfaces USB2.0 Host, USB2.0 OTG, HDMI v1.4 WUXGA, USB2.0 Header, RJ45 10/100 Mbit Ethernet, RS232 D-Sub 9, 3.5mm stereo audio headphone jack
    On request Wireless Communication Trizeps VII option: Onboard WLAN and Bluetooth module, IEEE 802.11 a/b/g/n/e/i/h/d/k/r/w, +18 dBm, 72 Mbps (20 MHz) and up to 150 Mbps (40 MHz), Bluetooth 3.0+ EDR
    Expandability pConXS LC (external connectivity on request)
    Additional features and interfaces USB2.0 Header, μSD card socket, FX11 high-speed board to board connector, I2C extension header, reset and user tactile switch, MiPi camera connector (Raspberry Pi)
    Extension connector interfaces SL2-40 2.54mm Pin header: Power (3V3, 5V, Vin fused), GPIOs (1x with PWM), SPDIF (out and in), stereo headphone (16Ω and 32Ω), speaker (Mono, 8Ω), LineIn, microphone, 2 x UARTs, 2x CAN, SDIO, I2C, 3 x ADCs
    General Details
    Operating Systems Microsoft Windows Embedded Compact 7
    Android JB 4.2.2 - 1.1.0 ASOP, Build-via VirtualBox: Ubuntu 12.04 LTS
    Voltage Supply Industrial +12 up to +24V supply
    Operating Temperature -20°C to +70°C
    Dimensions 226 x 146 x 55 mm (W x H x D)
    Environmental Standard RoHS, REACH, WEEE
    Availability 10 years form, function*
    Order code 39 100 (incl. pConXS LC baseboard, without Trizeps VII CPU module)
    i-PAN X7 LC Evaluation Kit with Android/Linux OS
    Inclusive pConXS LC baseboard
    Trizeps VII Solo /IT800/R1G.2/µSD/ETH/CODW/RoHS (order code 37 113.IT08)
    4 GB µSD card with Android/Linux OS
    12V power supply, cable set
    Order code 39 010.EVK
    Versions with other Trizeps VII types on request
    i-PAN X7 LC Evaluation Kit with Microsoft Windows Embedded Compact 7 OS
    Inclusive pConXS LC baseboard
    Trizeps VII Solo /IT800/R1G.2/µSD/ETH/CODW/RoHS (order code 37 113.IT08)
    4 GB µSD card with Microsoft Windows Embedded Compact 7 OS
    12V power supply, cable set
    Level 2 Support (180 days, max. 4 h)
    Order code 39 020.EVK
    Versions with other Trizeps VII types on request
    Technical modifications reserved, errors excepted / *beginning product life circle