Keith Koep
TECHNOLOGY PARTNER
ARM CONNECTED Windows Freescale Marvell
Trizeps VII
 
FEATURES TECH. DATA COMPONENTS EVAL-KITS
  • SPECIAL FEATURES

    High-performance i.MX6 CPU Modul with minimum space requirement

    With the high-performance Freescale i.MX6 processor the Trizeps VII is suitable for multimedia, multitouch and multidisplay applications as well as for demanding control tasks.

    freescale i.mx6 components

    The Trizeps VII provides in the tightest space the full performance potential and entire interface variety of the Freescale i.MX6 processor. All connection pins of the processor have functions assigned to them and can be accessed via PinMUX and equipment options. That makes the Trizeps VII one of the world's most variable and compact i.MX6 CPU modules.

    Configuration

    1 Freescale i.MX6 ARM Cortex A9 Prozessor Quad(Q), Dual(D), DualLite(U) or Solo(S)  7 WLAN-Bluetooth module (optional): IEEE 802.11 a/b/g/n/e/i/h/d/k/r/w, +18 dBm, 72 Mbps (20 MHz) up to 150 Mbps (40 MHz), Bluetooth 3.0+ EDR
    2 DDR3 RAM (Solo, DualLite 32 Bit / Dual, Quad 64 Bit)  8 Power Management IC (PMIC)
    3 SODIMM 200 connector interfaces:
    24Bit RGB LCD, 8 Bit Camera, Address Data Bus, USB 2.0 Host, USB 2.0 OTG, 2x FlexCAN, PCI-Express, 3x UARTs, I2C, SPI, GPIOs, PWM, RTC, AC97, headphone out, speaker out, microphone, LineIn, Resistive touch, ACDs, 10/100 MBit Ethernet, 4 Bit SD1 port, PCM, 3V3 power supply
     9 FX11 High-Speed board-to-board connector, 60 pole interfaces:
    MIPI camera, MIPI display, SATA-II, Dual-LVDS (WUXGA), HDMI v1.4 (3D, 4k x 2k, 1080p), RGMII 10/100/1000MBit
    4 Socket for μSD cards (4 bit) or optional eMMC (8 bit) 10 Ethernet Transceiver
    5 Bluetooth UFL Coax connector (optional), 2,4 GHz 11 Audio Codec / Resistive touch
    6 WLAN UFL Coax connector (optional), 2,4 GHz, 5 GHz 12 Ground potential for EMC heat sink connection

    Microsoft Windows Embedded Compact 7 and Linux / Android (version 4.2.2) operating systems are available.

    freescale i.mx6 FX11 connector
    Min. 40% smaller than comparable i.MX6 CPU modules The FX11 connector safes a secure connection to the high-speed interfaces
  • TECHNICAL DATA

    Freescale i.MX6 CPU-Module Freescale i.MX6 SODIMM-200 CPU-Module

    Compact and scaleable Compact and scaleable

    SODIMM-200 compatible Trizeps SODIMM-200 compatible

    Highspeed-functions Additional highspeed-functions with the new
       board-to-board connector

    Dual antenna Dual antenna +18dBm WiFi / BT

    Audio codec and ethernet Audio codec and ethernet transceiver

    64 Bit RAM 64 Bit RAM

    freescale imx6 cpu module ARM imx6 android windows ce
    Variable Features
    Processor Freescale™ i.MX 6 ARM® Cortex™ A9, MP-CPU, 800 MHz up to 1.0 GHz per Core, 1 MB L2 Cache
    RAM Memory 4 x 16 Bit DDR3-1066 (533 MHz), 64 Bit 1 CS
    Flash Storage onboard 4 Bit wide μSD Socket (standard) or onboard 8 Bit wide eMMC (on request)
    Wireless Communication Onboard WLAN-Bluetooth module, fits four different Lesswire module types (on request)
    Options
    Processor CPU-Type: Quad(Q), Dual(D), DualLite(U) and Solo(S)
    RAM Memory 256 MByte − 2 GByte 64 Bit
    Flash Storage μSD 4 GB (option up to 32 GB), eMMC-Type: 4 GB (option up to 64 GB)
    Wireless Communication IEEE 802.11 a/b/g/n/e/i/h/d/k/r/w, +18 dBm, 72 Mbps (20 MHz) and up to 150 Mbps (40 MHz), Bluetooth 3.0+ EDR
    Onboard Features
    Display Interfaces HDMI v1.4, 2 x LVDS, LCD 24 Bit RGB, MIPI (supports 3D, 4k x 2k and 2 x 1080p Displays)
    Interfaces USB 2.0 Host and OTG, 2 x FlexCAN, S-ATAII, PCIe, 2 x 4 Bit wide SDIO, RTC, SPDIF, Adress-Data-Bus, 3 x UARTs, 2 x I2C, 2 x SPI, GPIOs, 2 x PWMs
    Ethernet Onboard 10/100 Mbit RMII PHY and 10/100/1000 Mbit RGMII interface
    (can not be used at the same time)
    Extension Connector Additional FX11 60pol. high-speed board to board connector
    Camera Interfaces 8bit parallel camera and MIPI serial camera (supports 2 x cameras at the same time)
    Audio Codec AC´97 Audio Codec with 4/5 wires res. Touch and 4 x 12 Bit ADC (2 x comparator inputs for battery monitoring), Stereo: Line-in, Mic-in, Speaker-out, Headphone out
    Power High-Eff. PMIC with single supply controlled by I2C
    SODIMM200 Card Edge Connector Pin compatible to Trizeps IV, IV-M, IV-WL, V and VI Modules
    General Details
    Operating Systems Microsoft Windows Embedded Compact 7 /
    Android JB 4.2.2 - 1.1.0 ASOP, Build-via VirtualBox: Ubuntu 12.04 LTS
    Voltage Supply +3V3 DC
    Operating Temperature -40°C bis +85°C (industrial), -20°C bis +85°C (extended consumer)
    Board Dimensions 67.6 mm x 36.7 mm x 6.4 mm, 15 gr. (incl. μSD Socket)
    Environmental Standard RoHS, REACH, WEEE
    Availability 10 years form, function*
    Technical modifications reserved, errors excepted / *beginning product life circle
  • KOMPONENTEN


    i-PAN X7

    Glass touch panel computer with
    build-in housing
    Neu
    i.MX6 touchpanel info

    Intelligent Touch Panel Build-in industrial PanelPC solution

    prjektiv,kapazitiv 7.0" projected capacitive touchscreen LCD with 2 mm
       front glass

    Optical Bonding Optimal touch functionality using an optical bonding process
       to bond the display to the glass pane

    IP 65 IP65 protection level for the frontside installation area

    WLAN/Bluetooth Wireless communication via Trizeps onboard WiFi and Bluetooth
       components on request

    PeripheralsDirect access via standard connectors

    Eval-Kit The device is also available as an evaluation kit

    i-PAN7

    Compact touch panel computer with
    aluminium assembly frame
    i.MX6 Hmi Touchpanel info

    Flache PanelPC Lösung Powerful and complete industrial panel PC solution with
       7.0" Touchscreen, resistive or capacitive

    Display Schnittstellen The flat aluminium frame allows a simple integration in
       an existing housing

    Small Hmi Wireless communication via Trizeps onboard WiFi and Bluetooth
       components on request

    Peripheriegeräte Peripherals: direct access through multipole extension headers

    Eval-Kit The device is also available as an evaluation kit

    i-PAN5

    Modular touch panel computer
    i.MX6 Hmi Touchpanel info

    Skallierbare PanelPC Lösung High-performance industrial touch panel which components
       are available separately or as assembly units

    Display Schnittstellen HDMI V1.4, Dual LVDS or Touchscreen LCDs in different sizes,
       resistive or capacitive

    Small Hmi Wireless communication via Trizeps onboard WiFi and Bluetooth
       components on request

    Peripheriegeräte Peripherals: direct access via standard connectors and
       extension header

    Schnittstellen CAN, RS485 und SATA II connector, 3-Axis digital
       accelerometer, RTC

    Eval-Kit The device is also available as an evaluation kit

    iP5-Base

    Trizeps SODIMM 200 Baseboard
    i.MX6 Baseboard info

    Kompaktes i.mx6 baseboard Compact and scalable carrierboard with standard interfaces

    Display Schnittstellen Supports HDMI V1.4, Dual LVDS or Touchscreen LCDs in
       different sizes

    3-Axis Accelerometer 3-Axis digital accelerometer, RTC with backup battery

    Peripheriegeräte Peripherals: direct access via standard connectors and
       extension header

    Schnittstellen CAN, RS485 and SATA II connectorr

    i-PAN5 Baseboard Baseboard from i-PAN5

    pConXS

    Trizeps VII SODIMM 200 Baseboard
    pconxs i.MX6 baseboard info

    Kompaktes i.mx6 baseboard Very compact and scalable i.MX6 Carrierboard

    Versionen As Low Cost (LC) or Full Function (FF) Version available

    Display Schnittstellen Supports HDMI or touchscreen LCDs in different sizes

    Peripherals Peripherals: direct access via extension header and standard
       connectors

    Features USB2.0 4-Port Hub, RTC

    Features Only FF Version: Mini PCIe half-/full size card edge connector,
       SATA II, direct analog and MIPI camera connector, 3-Axis digital
       accelerometer, temperatur sensor